Application of spinning accessories in various metal spinning technologies

The basic principle of metal spinning technology of spinning machine is similar to ancient pottery production technology. Spinning forming parts are generally rotary cylindrical parts or disc-shaped parts, and spinning parts blanks are usually thick-walled cylindrical parts or circular plates. The principle and structure of a spinning machine are similar to a metal cutting lathe. Today's spinning requires the help of spinning accessories.

The principle of spinning accessories is that the position of the large carriage of the lathe is designed as a rotary wheel frame with axial movement power, and the rotary wheel fixed on the rotary wheel frame can move radially. Coaxially connected with the main shaft is a core mold (shaft), and the spinning blank is sleeved on the core mold (shaft). The rotating wheel passively rotates in reverse by the friction force generated by contact with the blank sleeved on the core mold (shaft). At the same time, the rotary wheel frame moves axially under the action of the large axial thrust cylinder.

Spinning pulley type The rotating wheel frame performs point-by-point continuous plastic deformation on the surface of the blank under the combined action of the axial force and the radial force of the rotating wheel. At the position of the lathe tail top bracket, a tail top hydraulic cylinder designed on the same axis as the main shaft, the hydraulic cylinder exerts an axial thrust on the end face of the blank sleeved on the core mold (shaft). The base material of the spinning accessories is aluminum alloy with a thickness of 2mm. Aluminum is in a relatively negative position in the electrochemical sequence, and it has an extremely high affinity for oxygen. These two factors cause aluminum and aluminum alloy to be electroplated Difficulties. After the oxide film on the surface of aluminum and aluminum alloy is removed in the lye, a new oxide film is formed quickly when it encounters oxygen in the air. This oxide film seriously affects the bonding force of the electroplated layer and the substrate.

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